HY610 Gold Thermal Paste - >3.05 W/m·K CPU & Heatsink Compound, Syringe
Compound – Large Syringe
AlcellReliable delivery, every order
When do I get it?
Estimated delivery times depend on where you are. Your exact date is confirmed at checkout.
| Delivery destination | Delivery time |
|---|---|
| Cape Town, Durban, Johannesburg & Pretoria | 1–3 working days |
| Regional areas | 5–6 working days |
| Remote areas | 3–7 working days |
- Interest Free Payments available
- Hassle Free Returns within 7 days
- 12-month limited warranty
Description
The HY610 Gold Thermal Paste serves as a premium heat-transfer medium designed to fill the micro-gaps between heat-generating electronics and cooling systems. This paste replaces air pockets with a highly conductive compound, establishing an optimized thermal bridge that boosts overall component performance and system stability. It arrives in a convenient high-capacity syringe package, making it perfect for custom PC builders, multi-system installations, and repair technicians
Enhanced Heat Conductivity: Delivers a thermal conductivity rating of >3.05 W/m-K, allowing for significantly quicker and more efficient heat transfer than standard grey or white pastes.
Low Thermal Impedance: Keeps interface resistance under <0.073 °C-in`b2/W, which minimizes heat retention at the contact barrier and drives processor temperatures down.
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Product Information
| Warranty | 12-month limited warranty |
| Categories | Computers / Office |
| Brand | HY |
| Thermal Conductivity | > 3.05 W/m·K |
| Type | Gold thermal interface compound |
| Packaging | High-capacity syringe |
| Use | Fills micro-gaps between chips and heatsinks |
| Best For | Custom PC builds, multi-system installs and repair work |
| SKU | HY610 |
