RELIFE RL-044 Universal BGA Reballing Stencil - 0.3-0.5mm Pads, Stainless Steel

Universal BGA stencil for multiple applications The RELIFE RL-044 stencil is designed for 0.3/0.35/0.4/0.5 mm solder pads and supports parallel and 45-degree hole configurations, making it ideal for diverse reballing needs across various BGA components.
Precision stainless steel construction Made from high-quality stainless steel, this stencil ensures long-term durability and maintains precise aperture alignment, delivering consistent solder paste application during reballing processes.
Perfect fit for commercial manufacturing Engineered for commercial manufacture, the RELIFE RL-044 meets professional standards, offering reliable performance for high-volume and precision soldering operations in industrial environments.
Single-piece packaging for simplicity Each pack includes 1 piece of the stencil, providing a clean, straightforward solution for users who need a single replacement or dedicated tool without extra bulk or complexity.
Compact and lightweight for easy storage With a package size of 10 x 10 x 10 cm and a weight of 0.050 kg, this stencil is easy to store, transport, and organize in any workspace or toolkit.
Trusted brand with global reach Crafted by RELIFE, this stencil reflects consistent quality and reliability, making it a preferred choice for technicians and engineers worldwide seeking dependable hand tool parts.